28.04.2015 h2a1 - h365 1 / 4 h2a1 - h365 - r4 high power single chip led h2a1 - h365 is a ingan based, high power 365 nm single chip led in standard hexagonal aluminum package for general application. slots in the aluminum - core pcb allow for easy mounting of standard collimating optic s and are also suitable for m3 or m4 mounting screws. large electrical interconnection pads on the pcb allow for convenient installation. specifications ? ? peak wavelength: 365 nm ? optical output power: typ. 270 mw ? life time: > 10.000 h ours ? lead free product - rohs compliant absolute maximum ratings (t a =25c) parameter symbol value unit power dissipation, dc p d 1000 mw forward current, dc i f 5 00 ma pulsed current (1% duty cycle, 1khz) i fp 1000 ma reverse voltage u r - 5 v opera ting temperature t opr - 30 ? +70 c storage temperature t stg - 30 ? +85 c soldering temperature (max. 1,5 s) t sol 330 c electro - optical characteristics (t a =25c) parameter symbol condition min. typ. max. unit forward current i f 350 ma viewing a ngle 75 d eg. cw output power (rank 4) p o i f = 350 ma 270 mw peak wavelength ? device materials item material foundation plastic lens silicone resin electrodes agcu pcb al
28.04.2015 h2a1 - h365 2 / 4 typical performance characteristics normali zed output power vs. wavelength : outline dimensions emitter:
28.04.2015 h2a1 - h365 3 / 4 radiation pattern (lambertian lens without optics) relative intensity vs. angular displacement accessories collimating optics, holders, reflectors clp17cr, 6 metalized polycarbonate reflector clp23cr, 20 metalized polycarbonate reflector static electricity leds are very sensitive to static electricity and surg e voltage. it is recommended to wear a wristband or an anti - electrostatic glove whenever handling the leds all devices, equipment , and machinery that is used when handling the leds must be grounded properly. heat generation it is advised to op erate these leds at a reasonable low temperature for long lifetime and stability. high operating temperature will result in premature degradation and shortened lifetime.
28.04.2015 h2a1 - h365 4 / 4 soldering conditions reflow soldering: apg2c1 leds have a maximum storage te mperature of 85. therefor it is not possible to use a reflow soldering process for array assembly! hot bar soldering: a hot bar soldering process is recommended when soldering apg2c1 emitters. this process will only transfer heat to the leads and avoids o verheating the emitter which will damage the device. in order to transfer sufficient heat from the hot bar to the device, following parameters must be carefully considered: ? amount of flux ? pressing force of solder tip ? hot bar temperature for the standard as sembly process, following parameters should be maintained: ? hot bar temperature: 330 c ? force of hot bar. 40 n ? soldering time: 1.5 s it is recommended to use a copper nickel - plated hot bar mounted to standard temperature controlled soldering equipment. manu al hand soldering: for prototype build or small series production runs, it is possible to place and solder the emitters by hand. it is therefore recommended to maintain the following parameters: ? solder tip temperature 330 c ? soldering time. < 1.5 s ? junctio n temperature must be kept below 70 c a visual inspection may be used to check the quality of the solder joint general soldering precautions: ? mechanical stress, shock and vibration must be avoided during soldering ? only use non corrosive flux. ? do not apply current to the device until it has cooled down to room temperature after soldering.
|
